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1-6 of 6
Keywords: curing
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2011, 133(3): 031016.
Published Online: June 16, 2011
...) array. This novel manipulation can be utilized to fabricate an aspherical lens on a fiber array after the UV curing of the photo-sensitive polymer; the coupling efficiency (CE) is increased and exceeds 47% between the LD array and the fiber array. Plastic optical fibers (POFs) of the step-index (SI...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. February 2011, 133(1): 011005.
Published Online: January 24, 2011
...Thomas W. Secord; Susan C. Mantell; Kim A. Stelson In thermosetting composite manufacturing, part thickness, mold temperature, pressure, and resin kinetics can affect the uniformity of cure in the finished part. If the interaction of these parameters is not accounted for, then unwanted overshoot...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. February 2011, 133(1): 011002.
Published Online: January 5, 2011
...Daniel Walczyk; Jaron Kuppers; Casey Hoffman Curing and consolidating thermoset composite laminates and sandwich structures typically involves vacuum bagging an uncured and formed layup over a thin-walled mold, placing it in an autoclave, and subjecting the entire unit to temperature, vacuum...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2008, 130(2): 021005.
Published Online: March 7, 2008
... chip forms a UV light pattern, created by a graphic software, to fabricate a single layer of a 3D scaffold. The light pattern or “photomask” is projected by optical lens onto the monomer bath to simultaneously cure the monomer under a single exposure. After one layer of monomer is selectively cured...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. May 2005, 127(2): 350–357.
Published Online: April 25, 2005
...Edward C. De Meter, Professor, Light Activated Adhesive Gripper (LAAG) workholding technology is a means by which a workpiece is held by adhesive joints that can be instantaneously cured or destroyed, on demand. A LAAG joint is the adhesive bond between the gripper pin and workpiece. Due...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. May 2005, 127(2): 411–419.
Published Online: April 25, 2005
... strength is controlled mainly by the peak curing temperature and the heating rate. The maximum bonding strength appears between 70 and 110°C, but the value of it depends on the heating rate. At heating rates of 10, 50, and 100°C/min, the peak strength decreases with increasing heating rate. However...