A physical and mathematical model of the evaporating thick liquid film, attached to the liquid-vapor meniscus in a circular micropore, has been developed. The liquid flow has been coupled with the vapor flow along the liquid-vapor interface. The model includes quasi-one-dimensional compressible steady-state momentum conservation for the vapor and also a simplified description of the microfilm at the end of the thick film. The numerical results, obtained for water, demonstrate that formation of extended thick liquid films in micropores can take place due to high-velocity vapor flow under high rates of vaporization. The model has also predicted that the available capillary pressure significantly changes with the wall-vapor superheat and other operational conditions.
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Thick-Film Phenomenon in High-Heat-Flux Evaporation From Cylindrical Pores
D. Khrustalev,
D. Khrustalev
Department of Mechanical Engineering, University of Connecticut, Storrs, CT 06269
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A. Faghri
A. Faghri
Department of Mechanical Engineering, University of Connecticut, Storrs, CT 06269
Search for other works by this author on:
D. Khrustalev
Department of Mechanical Engineering, University of Connecticut, Storrs, CT 06269
A. Faghri
Department of Mechanical Engineering, University of Connecticut, Storrs, CT 06269
J. Heat Transfer. May 1997, 119(2): 272-278 (7 pages)
Published Online: May 1, 1997
Article history
Revised:
January 17, 1996
Received:
August 16, 1996
Online:
December 5, 2007
Citation
Khrustalev, D., and Faghri, A. (May 1, 1997). "Thick-Film Phenomenon in High-Heat-Flux Evaporation From Cylindrical Pores." ASME. J. Heat Transfer. May 1997; 119(2): 272–278. https://doi.org/10.1115/1.2824220
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