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Keywords: without solder
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2013, 135(4): 044501.
Paper No: EP-13-1024
Published Online: September 6, 2013
...; published online September 6, 2013. Assoc. Editor: Yi-Shao Lai. 10 04 2013 25 07 2013 The feasibility of laser direct welding quad flat pack (QFP) device without solder is analyzed and practiced. The relations between the tensile strength of QFP joints and laser welding parameters...
