...) of chip during realignment 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder...

...A. Polyakov; M. Bartek; J. N. Burghartz This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5 ± 3.9 J / m 2...

... 2004 integrated circuit interconnections integrated circuit packaging electroplating optimisation photolithography reliability integrated circuit reliability response surface methodology silicon thermal expansion wafer bonding The rapid advances in IC design and fabrication...

... with bonding quality at room temperature. Bonding strength increased as the annealing temperatures increased to 400 ° C , but debonding occurred at 450 ° C . The difference in thermal expansion coefficients of the glass and the Si wafer used led to this debonding. When wafers bonded at room temperature were...