... designs for high strain-rate life cycle loading. Examples of high strain-rate loading include drop events, blast events, vibration, ultrasonic process steps, etc. New design iterations invariably bring new unexpected failure modes under such loading and costly trial-and-error design fixes are often...

...A. F. Askari Farahani; M. Al-Bassyiouni; A. Dasgupta The development of portable electronics poses design challenges when evolving new designs for high strain-rate life cycle loading, such as in drop events, blast events, vibration, ultrasonic process steps, etc. This paper discusses...

...Y. Zhou; M. Al-Bassyiouni; A. Dasgupta In this paper, the vibration durability of both SAC305 and Sn37Pb interconnects are investigated with narrow-band harmonic vibration tests conducted at the first natural frequency of the test, printed wiring board, using constant-amplitude excitation. A time...

... printed circuits shock waves vibrations MEMS shock electrostatic force PCB motion Recently, there has been considerable interest in the reliability research on microelecromechanical system (MEMS) under shock and vibration effects. This has been boosted by the development of portable...

...Andy Perkins; Suresh K. Sitaraman Solder joint fatigue failure under vibration loading continues to be a concern in microelectronic industry. Existing literature has not adequately addressed high-cycle fatigue failure of high-lead solder joints, especially under a broad spectrum of vibration...

... in a vibrating environment, additional strains shorten the fatigue life of a solder joint. Reliability of these joints in new packages is determined by laboratory tests. In order to use the FEM to replace these expensive reliability tests a unified constitutive model for Pb40/Sn60 solder joints has been...

...J. H. Ong; G. H. Lim A general approach for finding the optimal support locations to maximize the fundamental natural frequency of vibrating structures is described in this paper. The key to the procedure is to place the necessary supports in such a way, so as to eliminate the lower modes from...

...). After the CBGA modules were placed on PCBs, the specimens were divided into two groups, and reflowed in nitrogen and compressed air separately. Properties of the six groups of assemblies, such as shear strength, bending fatigue life, thermal shock cycles, and vibration fatigue life, were tested to find...

... presents a general methodology of failure analysis and fatigue prediction of these electronic components under automotive vibration environments. Mechanical performance of these packages is studied through finite element modeling approach for given vibration environments in automotive application...