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Keywords: transmission electron microscopy
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
Published Online: July 26, 2002
...G. Y. Li; Y. C. Chan Intermetallics formation between metallization conductor Pd-Ag and solder 62Sn-36Pb-2Ag have been investigated by transmission electron microscopy (TEM) and X-Ray diffraction. Energy-dispersive X-Ray (EDX) analysis and Selected Area Electron Diffraction (SAED) analysis reveals...
