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Keywords: transient structural responses
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
Published Online: April 18, 2006
... testing brittle fracture solders electronics packaging reliability ball impact test (BIT) solder joint structural dynamics transient structural responses design guideline The prevalence of mobile electronic devices along with the adoption of stiffer and more brittle lead-free solder...
