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Keywords: thick film circuits
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
Published Online: July 26, 2002
... ENGINEERS . Manuscript received by the Electronic and Photonic Packaging Division August 3, 1998. Assoc. Editor: Y.-H. Pao. 03 August 1998 26 07 2002 reflow soldering chemical interdiffusion integrated circuit metallisation thick film circuits hybrid integrated circuits...
