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Keywords: thermoelectricity
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
...Huy N. Phan; Dereje Agonafer Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex mathematical equations or the assistance of an expensive computation-fluid...
