... optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray...

... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...

... . 10.1016/j.microrel.2007.08.008 29 11 2009 08 08 2010 30 09 2010 30 09 2010 cracks fracture mechanics insulated gate bipolar transistors lead bonding power bipolar transistors semiconductor device reliability temperature distribution thermal analysis thermal stress...

... integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip chip ball grid array (BGA) with an elastic underfill were investigated. As material...

... 2007 08 05 2008 aluminium compounds gas lasers laser beam cutting laser beam machining thermal stress cracking aluminum nitride cutting laser thermal stress packaging material Aluminum nitride (AlN) is an effective electronic packaging material due to its excellent...

.... Furthermore, if the surface of the initiator cools faster than the center, cracking is more likely. Basic elements of a bridge-wire initiator 24 05 2006 29 11 2006 cooling finite element analysis glass seals (stoppers) thermal management (packaging) thermal stress cracking...

..., 2004. Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress...

.... The thermomechanical properties of underfill therefore become crucial factors to the service life of FCBGA. ball grid arrays flip-chip devices failure (mechanical) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal...

... OF ELECTRONIC PACKAGING . Manuscript received May 2003; final revision, Jan. 2004. Associate Editor: S. McKeown. 01 May 2003 01 Jan 2004 06 10 2004 thermoelasticity heat conduction thermal stress cracking integrated circuit reliability thermal stresses Fourier series integrated...

... management (packaging) soldering thermal stress cracking fracture delamination 22 07 2004 28 07 2004 Phase angle ( r ̂ = 10 μ m ) at different crack lengths and positions Energy release rate G (right crack tip) at different crack lengths...

... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon To fabricate interconnect bump with BCB passivation, the adhesion promoter (AP3000 [Vinyltriacetoxysilane]) and BCB (Cyclotene™ 4024) were spin-coated on p-type (100) Si substrates...

... are obtained. 16 05 2004 08 06 2004 31 05 2004 integrated circuit packaging plastic packaging encapsulation soldering delamination fracture mechanics viscoelasticity elasticity thermal analysis thermal stress cracking When a plastic IC package is in a reflow soldering...

..., and various surface mount device (SMD) packages suffers the uncertainties of the material database for lead-free solders. soldering flip-chip devices creep thermal stress cracking fatigue 01 November 2002 15 12 2003 Contributed by the Electronic and Photonic Packaging Division...

... development and testing is continuously gaining importance, especially since the development of area array packages. soldering chip scale packaging ball grid arrays integrated circuit reliability creep flip-chip devices thermal stress cracking finite element analysis failure analysis...

... stress analysis thermal stress cracking temperature distribution plastic packaging Flip chip (FC) technology can achieve the highest ratio of active silicon surface area since it does not employ the peripheral wire bonding. In this way, it can be used to achieve a very large number of fine...

... 2002 17 09 2003 ball grid arrays thermal stress cracking soldering reliability surface mount technology finite element analysis Thermal fatigue has been one of the most serious problems for solder joint reliability in electronic packaging. Many researchers have studied...

... Congress, New York, NY, November 11–16, 2001. Manuscript received at ASME Headquarters, Sept. 2002. Associate Editor: J. Lau. 11 November 2001 01 Sep 2002 17 09 2003 plastic packaging ball grid arrays thermal stress cracking soldering finite element analysis modelling...

... modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking Thermal stresses and deformations are the major contributor to malfunctions of, and failures in, microelectronics and photonics systems. Various kinds of thermal stress and strain induced failures...

... and compared with experimental results. soldering finite element analysis ball grid arrays integrated circuit packaging thermal stress cracking modelling viscoplasticity With the increasing use of surface mount bonding technology in microelectronics industry, the reliability concerns...

... dissimilar materials as shown in Fig. 1 , which are stress singular points. moisture moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis 21 April 2001 04 January 2002...