... of the coefficient of thermal expansion (CTE) mismatch between the laser bar and the copper heat sink, the interfacial thermomechanical stress will cause a noticeable curvature of the laser diode and a blueshift in the wavelength. thermal stress optoelectronic performance high power laser diode voids...

... – 293 . 10.1115/1.1572904 http://focus.ti.com/ . Lau , J. H. , 1993 , Thermal Stress and Strain in Microelectronics Packaging , Van Nostrand Reinhold , New York . Jaeger , R. C. , Suhling , J. C. , Carey , M. T. , and Johnson , R. W. , 1993 , “ Off-Axis...

..., created a crack along the middle path of laser beam and caused material separation through unstable crack propagation. The benefits associated with thermal stress fracture method over the traditional method are improved cut quality, higher cutting speed, and lower energy losses. 02 12 2006 05 09...

...Zone-Ching Lin; Chang-Cheng Chen A molding model is established in this study based on a real integrated circuit for simulating the molding process. This paper presents both the temperature distribution and the thermal stress field of the molding model while the simulation proceeded along...