... 2005 12 05 2006 solders deformation indentation creep testing surface morphology stress relaxation finite element analysis Tin-based alloys are commonly used in microelectronics components. Thermal cycles are unavoidable and often lead to thermal fatigue damage and device...

... Zincating Deposits on the Al Pads of Si Chips ,” Thin Solid Films 0040-6090 , 288 ( 1–2 ), pp. 36 – 40 . Yau , E.-W.-C. , Gong , J.-F. , and Chan , P. , 2003 , “ Al Surface Morphology Effect on Flip-Chip Solder Bump Shear Strength ,” Microelectron. Reliab. 0026-2714 , 44 ( 2 ), pp...

... properties, including modulus reduction, Tg depression, polymer hydrolysis, and surface swelling after exposing to humidity aging. The deterioration in reliability of aged ACF joint during reflow process was mainly caused by hydroscopic swelling-induced stress of ACF. 8 Surface morphology of cured ACF...

... 4024) and the damage mechanism of interconnect bump with BCB bumping dielectrics upon temperature cycling. Adhesion and fracture surface morphology after die shear testing show that the weakening and delamination of BCB passivation layer at the die corner is the main cause of the reduction of die...

.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding In recent years, the rapid market growth in portable and hand-held products challenges the electronic packaging industry...