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Keywords: surface finishing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... surface finishes of electroless Ni and immersion gold (ENIG) and organic solderability preservatives (OSP) were investigated. Bending fatigue resistance of VQFN with OSP finish is slightly better than ENIG finish case. The acceleration factor of failure at high temperature (125°C) is higher than...
