... testing silver alloys solders tin alloys lead-free solder low-cycle fatigue strain rate effect creep strain stress relaxation cyclic loading Solder joints are subjected to cyclic inelastic deformation due to electronic parts having different coefficients of thermal expansion. Since...

... increment Δ ε c creep strain increment Δ ε t c uniaxial creep strain increment Δ σ t stress relaxation amplitude E Young’s modulus W in inelastic strain energy density N f sw number of cycles to fatigue...

.... (ii) The stress sensitivity decreases after stress relaxation in nanoindentation creep tests. The saturated value is 1 in three solder balls. (iii) The morphology of indented surface consists of three parts: initial indentation, power-law creep, and granular surface. It suggests that the transition...

... at − 40 , 23, and 125 °C through shear loading. The chip is connected to the printed circuit board by means of solder joints made of 62%Sn–36%Pb–2%Ag alloy. It was shown that the creep rate of solder ball arrays could be investigated using a stress relaxation method. Under the shear relaxation mode...

... must therefore be controlled by selecting the appropriate mechanical properties of the adhesive film (ACF or NCF) and the build-up substrate material. Moreover, the interconnection reliability during moisture-resistance tests deteriorates because of stress relaxation near the glass-transition...

... of a shear stress relaxation experiment and a creep experiment both under nonisothermal conditions. Moreover, the effect of the creep behavior of the molding compound on the packaging process stress field and its evolution is investigated. Substantial cost saving was realized by package design optimization...

...D. Ingman; Y. Michlin A nonlinear viscoelastic damage accumulation model with a physical approach is presented with a view to describing stress relaxation in amorphous and partially crystalline polymers. The deformation is represented as stress-aided transition through a series of symmetrical...

... alloys soldering creep slip nucleation voids (solid) fatigue thermal stresses stress analysis viscoplasticity stress relaxation Eutectic Pb-Sn solder used in electronic packaging applications is known to be highly viscoplastic in use environments because of the high homologous...

..., 2001. Associate Editor: M. Shiratori. 15 October 2000 08 March 2001 copper integrated circuit interconnections thermal stresses stress relaxation interface phenomena failure analysis finite element analysis integrated circuit modelling diffusion barriers Finite...

... received by the EEPD August 9, 1999; revised manuscript received April 13, 2000. Associated Technical Editor: B. Michel. 09 August 1999 integrated circuit technology thermal stress cracking crack-edge stress field analysis thermoelasticity temperature distribution stress relaxation...