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Keywords: solid-state bonding process
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
Published Online: September 30, 2010
...Pin J. Wang; Chin C. Lee Silver flip-chip joints between silicon (Si) chips and copper (Cu) substrates were fabricated using a solid-state bonding process without any solder and without flux. The bonding process was performed at 250 ° C , compatible with typical reflow temperature for lead-free...
