...–Ag columns deform and their surfaces conform to and mate with the surface of Cu substrate. Solid-state bonding incurs when Ag atoms in Cu–Ag columns and Cu atoms in Cu substrates are brought within atomic distance so that they share conduction electrons. The Cu–Ag columns are indeed bonded to the Cu...

... interconnect solid-state bonding electronic packaging Si chips Cu substrates At present, nearly all large-scale integrated circuit (IC) chips are packaged with flip-chip technology. This means that the chip is flipped over and the active (front) side is connected to the package using a large number...