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Keywords: silver sintering
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
Published Online: March 8, 2023
..., and solar inverters. Die-attach interconnections form a critical part of power electronics devices. Silver sintering has been traditionally used for die-attach interconnections because of its high melting point and ability to form very thin thicknesses. However, the processing time compared with soldering...
