..., pure Ag joints have superior electrical and thermal properties. 27 01 2011 13 06 2011 30 09 2011 30 09 2011 bonding processes chromium copper electric properties flip-chip devices gold packaging silver soldering thermal expansion silver joints flip-chip...

... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . 31 08 2009 01 05 2010 30 09 2010 30 09 2010 flip-chip devices integrated circuit bonding silver joints flip-chip direct...