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Keywords: reliability data analysis
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020905.
Published Online: June 11, 2012
... a significant effect on the drop performance and played a vital role in influencing the package reliability. 31 07 2011 15 11 2011 11 06 2012 11 06 2012 WLCSP drop testing reliability data analysis solder The semiconductor industry has transitioned from various...
