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Keywords: peltier
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
Published Online: June 11, 2012
... to minimize the energy consumption in Peltier cooling. A study of conductive coupling and pulsed cooling in the context of multiple ultra-thin TEC modules on the active side of electronic package has not been performed before. Our ultimate goal is to develop an integrated framework which can help...