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Keywords: neural nets
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
Published Online: November 19, 2010
... of ultrasonic vibrations to the bonding interface ( 1 ). wire bonding bonding electrical signal feature extraction principal components analysis bond quality band-pass filters data acquisition electronics packaging feature extraction Hilbert transforms lead bonding neural nets principal...
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
... they require intensive computational effort. Advantages as well as disadvantages of these methods are discussed. 05 06 2007 06 12 2007 30 07 2008 design of experiments electronic design automation electronics packaging neural nets numerical analysis optimisation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
Published Online: April 19, 2006
... thermal and wiring density, have to be optimized simultaneously, it is difficult for the designer to optimize component locations without using a systematic optimization method. 12 12 2005 19 04 2006 printed circuit design thermal management (packaging) genetic algorithms neural...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
Published Online: November 16, 2004
.... This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level. 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 6–12.
Published Online: December 9, 1999
... design engineering neural nets fatigue moire fringes 29 July 1998 09 December 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING .  Manuscript received by the EEPD July 29, 1998; revision received December 9...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 13–19.
Published Online: August 13, 1999
... Technical Editor: B. Courtois. 10 February 1999 13 August 1999 packaging modules neural nets finite element analysis soldering integrated circuit packaging design engineering Materials used in the construction of electronic packages are often complex in their behavior...