...M. K. Abdullah; M. Z. Abdullah; M. A. Mujeebu; Horizon Gitano; Z. M. Ariff; R. Razali; K. A. Ahmad A three-dimensional numerical model is developed to simulate the mold filling behavior in the plastic encapsulation of microchips. The conventional Hele–Shaw approximation is inadequate to analyze...

... different from the experimental results. Several needed improvements to the electron-mobility model are proposed in this article. 06 04 2009 26 09 2009 04 03 2010 04 03 2010 conduction bands electron mobility internal stresses MOSFET moulding semiconductor device models...

... ) as a function of the temperature at 0 Pa. The dashed and solid lines correspond to a second-order polynomial fitting of the experimental results. 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding...

... Electronic Components and Technology Conference , Las Vegas , NV, May 21–24. Chew , S. , 1996 , “ Thermal and Viscoelastic Characterization of Transfer-Molded Epoxy Encapsulant During Simulated Post-Mold Cure ,” Proceedings 46th Electronic Components and Technology Conference , Orlando , FL, May...

... packaging reliability moisture humidity vapour pressure moulding Moisture plays an important role in the reliability of plastic electronic packaging. The presence of moisture in the plastic package induces hygroscopic stress through hygroswelling, induces vapor pressure that is responsible...

.... The effect on the overall model performance of different element types for the mold-filling analysis and the structural analysis is also investigated and discussed. In order to obtain more accurate results and in a shorter computational time for the combined (fluid and structural) paddle shift analysis...

...David J. J. Lowrie Two high profile goals of the electronics industry today are lead free and embedded passives. The following describes the design and construction of a populated and planarized “PCB” which accomplishes these goals. The Moulded Electronic Package also integrates bare die and other...

... based on the reliable prediction of the packaging process stresses. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Nov. 2002. 01 Nov 2002 15 12 2003 packaging moulding encapsulation...

...-dependent Young’s modulus [MPa] and CTE [ppm/°C] for the glue The major packaging processes and testing conditions include die attachment, wire bonding, molding, post mould curing, ink marking, solder testing, and temperature cycling. Figure 8 shows the thermal loading profile used...

...Hung-Lung Lee; Shyang-Jye Chang; Sheng-Jye Hwang, Associate Professor,; Francis Su; S. K. Chen This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing...

.... It combines global flow analysis (C-MOLD) and structure analysis (ANSYS) to become a solution for general wire sweep analysis. In order to simulate the behavior of epoxy flow in the IC package using C-MOLD Reactive Molding, one must create the geometry of the cavity using cross-flow modeling technique...

... dissimilar materials as shown in Fig. 1 , which are stress singular points. moisture moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis 21 April 2001 04 January 2002...

... material and die backside. Interestingly, the delamination exists as a gap of 20∼40 μm. In addition, the paper discusses the relative materials influences — for example, the moisture uptake of mold compound systems and die backside surface property effects. The degradation of the die attach material...

... . The size of the mold body is designed to be very big in comparison with the size of the EMC pellets to make sure the temperature of the mold won’t change a lot during the experiment, so the procedure of the experiment can be considered an isothermal experiment. 1 The schematic of the dilatometer...

.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD April 20, 2001. Associate Editor: B. Michel. 20 April 2001 02 05 2002 replica techniques moulding optical fabrication optical disc...

...Dagmar Beyerlein; Lee E. Hornberger Reducing integrated circuit (IC) plastic packaging production costs by improving the transfer mold and leadframe designs is a costly and time-consuming process. Rather than building mold and leadframe prototypes to perform empirical studies, this research...

... (=FPBGA) and warpage on Mold Array Package-BGA(=MAP-BGA) are significant disadvantages. To improve the performance of BGA packages, we studied various combinations of materials used for BGA package including molding compounds, die attach pastes, and substrates. From the above analysis, we concluded...

... polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal expansion compressive strength elastic moduli thermoelasticity The residual thermal stresses in molding compounds affect the mechanical reliability of microelectronic...

... . Manuscript received by the EEPD July 9, 1998; revised manuscript received January 9, 2000. Associate Technical Editor: B. Michel. 09 July 1998 09 January 2000 integrated circuit packaging thermal stresses soldering failure analysis integrated circuit reliability moulding integrated...

... . Manuscript received by the EEPD January 2000. Associate Editors: B. Courtois and B. Michel. 01 January 2000 integrated circuit packaging plastic packaging moisture environmental degradation moulding encapsulation Plastic encapsulated integrated circuits are gaining interest...