... shear test for pad cratering In the following, all of the above pad level test methods are compared and discussed in terms of their relevance to pad cratering at the assembly level. 22 02 2010 14 03 2011 14 09 2011 14 09 2011 brittleness laminates mechanical...

... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys lead-free solder alloy elastic-plastic-creep constitutive model time-independent strain time-dependent strain cyclic plasticity stress...

... as the elastic mismatch. 22 02 2009 18 09 2009 25 02 2010 25 02 2010 delamination mechanical testing shear strength thin films delamination blister test energy release rate phase angle shear effect Thin films have been finding more and more applications in diverse...

... nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed along the sides...

... 63Sn–37Pb solder lead alloys materials properties mechanical testing soldering solders tin alloys work hardening 23 02 2006 20 07 2006 2007 American Society of Mechanical Engineers ...

..., the package with smaller solder joints and a smaller joint pitch suffers a greater drop reliability concern. 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP...

... mechanical testing finite element analysis printed circuit boards (PCB) optimal support locations maximum fundamental frequency modal testing A printed circuit board (PCB) is a complex plate structure that is made primarily of fiberglass known as FR-4 and thin copper layers. In the design...

... deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding is a high yield, high speed automated...

.... 13 January 2004 03 June 2004 21 03 2005 adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron...

... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...

... April 10, 2000. Associate Editor: B. Courtois. 10 April 2000 plastic packaging circuit reliability flip-chip devices heat sinks design of experiments thermal stress cracking mechanical testing finite element analysis inspection Flip Chip Deformation Thermal and Mechanical...

... PACKAGING . Manuscript received by the EEPD March 15, 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic...