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Keywords: magnetic devices
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 323–327.
Published Online: November 25, 1999
... on the thermal performance of the magnetic device was also examined. For comparison, a test was conducted on a magnetic component at PR=1, without thermal underfill. This comparison revealed good agreement between the numerical and experimental results. Finally, a general model was proposed for conduction heat...