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Keywords: light emitting diodes
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2011, 133(3): 034501.
Published Online: September 14, 2011
...Eduardo Nogueira; Manuel Vázquez; Carlos Algora In this work, we have evaluated the reliability of epoxy packaged light emitting diodes (LEDs) for outdoor applications by specific tests to enhance catastrophic failures that appear under high temperature and humidity operation conditions...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
Published Online: June 17, 2011
... or light emitting diodes. Results from experimental measurements and numerical simulations to determine the electrical and thermal transport properties and characteristics of carbon nanotube networks and arrays used in the above applications are presented. The roles heterogeneous networks of semiconducting...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011009.
Published Online: March 10, 2011
...Yuan-Chang Lin; Jiun Pyng You; Nguyen T. Tran; Yongzhi He; Frank G. Shi Two types of packaged white light emitting diodes in which one has a flat-top (FT) emitting surface and the other is a flat-top-with-lens (FTWL) type are fabricated by using the same leadframe and investigated on their optical...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
...K. C. Yung; H. Liem; H. S. Choy; W. K. Lun This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041006.
Published Online: November 24, 2010
... component analysis and gray relational analysis to determine the optimal processing parameters for multiple quality characteristics of light emitting diodes (LEDs). The quality characteristics of this experiment include the candle light, forward voltage, and leakage current of LED and thrust value. First...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031010.
Published Online: September 30, 2010
...Jiun Pyng You; Yeong-Her Lin; Nguyen T. Tran; Frank G. Shi The thermal and optical characteristics of phosphor converted white light-emitting diodes (LEDs) with different phosphor concentrations ranging from 4 wt % to 13 wt % are investigated. The light output of LEDs with higher phosphor...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031011.
Published Online: September 30, 2010
...Xin Li; Xu Chen; Guo-Quan Lu As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041002.
Published Online: October 21, 2009
... and reliable manner. Plastic optical fiber (POF) has emerged as an ideal solution for meeting this requirement and is now specified by many architects as a simple, one-cable solution for home and office data communication networks. This study presents a modified flip-chip light emitting diode (LED) package...