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1-8 of 8
Keywords: laminates
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031007.
Published Online: September 14, 2011
...Brian D. Roggeman; Venkatesh Raghavan; Peter Borgesen The introduction of less compliant lead free solders together with weaker and more brittle laminate materials has led to major concerns with respect to the resistance of the latter to pad cratering. For purposes of laminate selection as well...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
Published Online: November 14, 2008
...Wataru Nakayama An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 353–356.
Published Online: October 31, 2004
...Jun Xu; Richard A. Wirtz Algebraic models of porosity, specific surface area, and in-plane effective thermal conductivity for stacked, two-dimensional symmetric diamond-weave screen laminations are developed and benchmarked with laboratory experiments. Diamond-weave laminations are found to have...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 178–184.
Published Online: September 30, 2004
..., as well as force-per-pin values of the LGA, and correlations were made between the two. Classical laminate theory was utilized to describe the warpage behavior of the assembly and a model was presented to solve the out-of-plane displacements. An overall assessment of the assembly was made and compared...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 134–138.
Published Online: March 14, 2003
... closed-form solution can offer a more rapid method to obtain the stresses at the interfaces. An analytical model for ply-level sub-laminate analysis is investigated in this paper. The theory presented treats each layer as a beam-type plate with orthotropic material properties. As an example, the results...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
Published Online: December 12, 2002
...Keith B. Bowman; David H. Mollenhauer As two dissimilar materials are bonded or cocured at elevated temperatures, residual stresses result upon cooling the layered material system to room temperature. It is well known that the free edges of composite laminates experience interlaminar stresses...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 77–84.
Published Online: May 2, 2002
...Xiaoling He; Robert E. Fulton, Fellow ASME Professor Nonlinear laminate theory is applied for the printed wiring board (PWB) dynamic response analysis. Equations of motion for the nonlinear elastic deformation of the isotropic laminates are derived for the dynamic response of a simply supported PWB...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 1–5.
Published Online: November 29, 2000
...Yarom Polsky; I. Charles Ume The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function...