... 07 2009 09 08 2010 09 12 2010 09 12 2010 aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography ball bonding bonding parameters gold aluminide surface topographical...

... diameter. Figure 10 schematically illustrates the mode of failure of the gold ball bonds with and without aging and copper ball bonds when shear tested. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear...

... bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity 03 August 2003 13 June 2004 03 06 2005 Contributed by the Electronic and Photonic...

... solutions based on a duromer MID approach. Manuscript received January 6, 2004; revision received June 24, 2004. Review conducted by: Y. C. Chan. 06 January 2004 24 June 2004 21 03 2005 chip scale packaging encapsulation integrated circuit interconnections integrated circuit...

... ENGINEERS . Manuscript received by the Electronic and Photonic Packaging Division August 3, 1998. Assoc. Editor: Y.-H. Pao. 03 August 1998 26 07 2002 reflow soldering chemical interdiffusion integrated circuit metallisation thick film circuits hybrid integrated circuits...