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Keywords: hybrid integrated circuits
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Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
... the allowable specifications, and should be reliable under most of the operating conditions. von Mises strain and stress at the critical solder joint of the transmitter 01 07 2010 04 05 2011 26 09 2011 26 09 2011 embedded systems hybrid integrated circuits integrated...
View Article titled, Embedded Three-Dimensional <span class="search-highlight">Hybrid</span> <span class="search-highlight">Integrated</span> <span class="search-highlight">Circuit</span> Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates&#x2F;Printed Circuit Boards
Open the PDF for Embedded Three-Dimensional <span class="search-highlight">Hybrid</span> <span class="search-highlight">Integrated</span> <span class="search-highlight">Circuit</span> Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards in another window
Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

G. Y. Li, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
https://doi.org/10.1115/1.1486012
Published Online: July 26, 2002
... ENGINEERS . Manuscript received by the Electronic and Photonic Packaging Division August 3, 1998. Assoc. Editor: Y.-H. Pao. 03 August 1998 26 07 2002 reflow soldering chemical interdiffusion integrated circuit metallisation thick film circuits hybrid integrated circuits...
View Article titled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
Open the PDF for An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder in another window
Topics: Electron diffraction, Intermetallic compounds, Solder joints, Solders, Tin, X-ray diffraction, Silver, X-rays, Transmission electron microscopy, Thick films