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Keywords: hot-spot
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
Published Online: June 11, 2012
...Owen Sullivan; Man Prakash Gupta; Saibal Mukhopadhyay; Satish Kumar Site-specific on-demand cooling of hot spots in microprocessors can reduce peak temperature and achieve a more uniform thermal profile on chip, thereby improve chip performance and increase the processor’s life time. An array...