... in cooling of high-power density packaging. Therefore, industries utilizing data centers are looking to single-phase immersion cooling to reduce the operational and cooling costs by enhancing the thermal management of servers. In this study, heat sinks with triply periodic minimal surface (TPMS) lattice...

... precisely in the x- , y- , and z -directions, each heater is mounted to an XYZ linear stage. Deionized water (DI) was used as the working fluid, and a pin-fin heat sink was used to run the initial steady-state tests on the experimental rig. The tests showed how different flow rates at a constant fluid...

... the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal...

...Yongtong Li; Liang Gong; Minghai Xu; Yogendra Joshi In this paper, a concept of metal foam heat sink with pin fins (MFPF heat sink) is proposed to improve the cooling performance of high-powered electronics with nonuniform heat flux. Numerical simulations are carried out to investigate...

...Georgios Karamanis; Marc Hodes We provide an algorithm to optimize the geometry of the fins in an array of longitudinal-fin heat sinks (HSs) in, e.g., a blade server, which is a prohibitively long task using computational fluid dynamics (CFD). First, banks of CFD simulations are run to precompute...

... October 6, 2014. Assoc. Editor: Pradip Dutta. 24 12 2013 19 06 2014 The attachment of a shield to a heat sink enhances the thermal performance. But, forming slots in the shield increases thermal resistance. We found that increasing the slot width enhances the flow performance over...

... a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches...

... in the calculation of mean velocities. The increase of pressure differences or channel depths can increase the cooling power of heat sinks. But if the cooling power is too large, there may be no appropriate channel dimensions because of the small specific heat of air. The main purpose of this work is to improve...

... for various parameters such as air velocities and source heat rates. In this study, we introduce a novel heat sink named as a hybrid fin heat sink (HFH) consisting of the array of hybrid fins (HFs). The HF is a hollow pin fin integrated with plate fins. The HFH may allow air flow via an internal channel...

... that need to be addressed before they can be successfully implemented in heat sink design. The interface between the device and heat sink is an important factor in the thermal design of microelectronics cooling. Depending on the thermal interface conditions and material properties, the contact pressure...

... strategies in data centers. Finally, the impact of heat sink thermal resistance is considered, and the potential data center efficiency gains from improved heat sink designs are discussed. 07 04 2011 09 05 2011 21 09 2011 21 09 2011 computer centres cooling fans heat sinks...

... areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which...

.... convection heat sink metal foam graphite foam electronics cooling Commercially produced metal foams are typically made from aluminum, nickel, steel, copper, and some of their alloys. These materials are known to have high thermal conductivities. This class of porous media has many practical...

...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...

...Zhipeng Duan; Y. S. Muzychka The performance of impingement air cooled plate fin heat sinks differs significantly from that of parallel flow plate fin heat sinks. A simple impingement flow pressure drop model based on developing laminar flow in rectangular channels is proposed. The model...

...Zhipeng Duan; Y. S. Muzychka Impingement cooling of plate fin heat sinks is examined. Experimental measurements of thermal performance were performed with four heat sinks of various impingement inlet widths, fin spacings, fin heights, and airflow velocities. The percent uncertainty in the measured...

...M. Baris Dogruoz; Alfonso Ortega; Russell V. Westphal A model for the pressure drop and heat transfer behavior of heat sinks with top bypass is presented. In addition to the characteristics of a traditional two-branch bypass model, the physics of tip leakage are taken into consideration. The total...

...Ta-Wei Lin; Ming-Chang Wu; Li-Kang Liu; Chun-Jen Fang; Ying-Huei Hung A series of experimental investigations on the studies related to transient- and steady-state cooling performance from the horizontally heated heat sinks with a confined slot jet impingement have been conducted. The relevant...

...Han-Ting Chen; Jenn-Tsong Horng; Po-Li Chen; Ying-Huei Hung An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed in the study. The thermal and hydrodynamic...

... best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints...