.... An experimental set up was prepared where a TE device was used in conjunction with heat exchanger and a cold plate to remove heat from electronics module. A finned copper rod in contact with hot side of TE device was used to reject the heat out to the ambient. The experimental set up was housed inside...

... of combinations have been checked using the 1D, L, and SLA equations discussed above. The criterion for “OK” was arbitrarily set at 15% deviation from the analytical solution. 15 11 2009 19 04 2010 09 09 2010 cooling cosmology heat exchangers heat transfer thermal resistance...

...Giulio Lorenzini; Simone Moretti Thermal conductance and loss of pressure are among the most relevant parameters based on which a heat exchanger has to be chosen. Starting from this observation this study treated and compared the performances of different exchanging systems, always in condition...

...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...

... simulations were also conducted to guide the experimental program. Effective heat transfer coefficients were also reverse-engineered using CFD software and the experimental results. 18 01 2007 19 04 2007 computational fluid dynamics copper graphite heat exchangers power amplifiers...

... 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first silicon device is fabricated, “real...

... modules heat exchangers product development cooling Electronic devices and equipment now permeate virtually every aspect of our daily life. Among the most ubiquitous of these is the electronic computer varying in size from the handheld personal digital assistant to large scale mainframes...

..., A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment , Hemisphere Publishing Corporation, Washington, DC. Kays, W. M., and London, A. L., 1984, Compact Heat Exchangers , 3rd Edition, McGraw-Hill, New York, NY. LaHaye , P. G. , Neugebauer , F. J...

..., companies are looking for innovative methods of providing system level cooling such as using soil heat exchangers. Numerical simulation using a system of lumped thermal capacitances coupled to a soil finite element model is used to predict the transient thermal behavior of a cabinet. The cabinet model has...