... were investigated using the split Hopkinson tensile bar experimental technique. Stress-strain curves of the three solders were obtained, and microstructure and fractography of the specimens before and after the tests were examined and presented. The experimental results show that the lead-free solders...

... stress conditions were imposed to investigate the effects of multiaxial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn 3.8 Ag 0.7 Cu and Sn – Pb eutectic solder. Fractography of fatigue tested samples...

... deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond thermosonic bonding interface In integrated circuit (IC) chip manufacturing, wire bonding is a high yield, high speed automated...