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Keywords: flow through porous media
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
..., such as those found in electronics cooling. The model ignores conduction in the fluid and assumes plug flow. 21 11 2007 18 02 2009 12 06 2009 convection flow through porous media metal foams Figure 1 is a schematic of a two-dimensional rectangular channel of height H...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 342–350.
Published Online: October 6, 2004
... sinks flow through porous media permeability aluminium convection Today’s trend in the electronic equipment industry toward denser and more powerful products requires a higher level of performance from cooling technology. Many ideas for cooling methods have been proposed—among them...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
Published Online: July 8, 2004
.... 01 April 2003 01 November 2003 08 07 2004 solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation Flip chip interconnects are being used in the electronics industry and have inherent advantages over other...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
Published Online: July 8, 2004
... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received May 2003; final revision, December 2003. Associate Editor: B. Sammakia. 01 May 2003 01 December 2003 08 07 2004 heat transfer heat sinks flow through porous media forced convection electronics packaging...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
Published Online: June 10, 2003
.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The control of operating temperature, regardless of power input, makes future use of CPL systems...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 274–278.
Published Online: July 11, 1999
... convection flow through porous media Green's function methods Studies on convective heat transfer and fluid flow in porous media have been motivated by a broad range of applications, including geothermal system, thermal insulation, heat pipes, etc. Recently, low permeability microporous materials...