... 11 2007 13 11 2008 01 04 2009 copper compounds electronics packaging fine-pitch technology laser beam applications nickel compounds silver compounds soldering tin compounds soldering laser lead-free solders QFP devices electronics assembly In recent years...

... nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed along the sides...

... indentation fine-pitch technology shear strength tin alloys silver alloys copper alloys Legislation and market demand is rapidly driving the electronics sector towards lead-free solders, with 2006 seeing the ban of lead-containing solders for the European community. However, despite the scale...

... production planning manufacturing processes assembling soldering surface mount technology fine-pitch technology printed circuit manufacture integrated circuit reliability laser beam applications 01 March 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...

... forming processes surface tension wetting soldering fine-pitch technology 01 February 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor. B...

... 2003 fine-pitch technology soldering flip-chip devices integrated circuit interconnections integrated circuit packaging aluminium microassembling Since the inception of C4 (controlled collapse chip connection) technology by IBM for their solid logic technology (SLT) more than 40...

... received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 adhesives packaging fine-pitch technology electrical conductivity conducting polymers nickel gold contact resistance The simple connection method using anisotropic conductive adhesive (ACA) is noted...

... 12 12 2002 micromechanical devices probes integrated circuit testing production testing fine-pitch technology contact resistance integrated circuit interconnections With the continued reduction in feature size and with the increased demand for better performance and lower cost...

...: S. M. Heinrich. 27 July 1999 26 07 2002 flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers Conductive adhesive joining in flip-chip...

... packaging flip-chip devices conducting materials adhesives finite element analysis electrical contacts fine-pitch technology Liquid crystal displays (LCD) have increasingly found industrial applications owing to their low power consumption, lower weight, better compatibility with LSI chips...

... Headquarters August 8, 2000. Associate Editor: B. Courtois 08 August 2000 ball grid arrays reliability moulding fine-pitch technology Plastic Ball Grid Array (BGA) and other area array packages have a large impact on the IC market all over the world due to its ease of assembly onto...