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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041111.
Paper No: EP-24-1027
Published Online: August 9, 2024
... on Titan. A thermal flow model was built in Solidworks Flow Simulation to evaluate the effectiveness of a fan system integrated into the packaging design and used as the primary method for cooling the RDE. The model was validated with temperature data collected from custom designed ground support equipment...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... the benefits of any data center design and operational strategies seeking to improve efficiency, such as temperature controlled fan algorithms. Using the models previously developed by the authors, this paper extends the analysis to include the electronics within the rack through considering the processor heat...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031004.
Published Online: June 23, 2009
... areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which...