...: S. M. Heinrich. 27 July 1999 26 07 2002 flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers Conductive adhesive joining in flip-chip...

... is referred to as characteristic life, and is the number of thermal cycles with 63.2 percent failure occurrence. ball grid arrays chip scale packaging ceramic packaging integrated circuit reliability failure analysis life testing environmental testing integrated circuit testing Weibull...

... surfaces light interferometry surface topography measurement thermal stresses environmental testing Microelectronics devices are comprised of various metal conductors separated by insulating materials. As a result of a mismatch of coefficient of thermal expansion (CTE), the devices warp...