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Keywords: electroplating
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
... ( 6 ), pp. 641 – 647 . 10.1109/JMEMS.2002.805214 Park , G. S. , Kim , Y. K. , Pak , K. K. , Kim , J. S. , Lee , J. H. , and Ju , B. K. , 2005 , “ Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
Published Online: February 18, 2009
...Xiaoqin Lin; Le Luo Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was used as SnAg solder bumping process. Multiple reflow was preformed on as-plated...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
Published Online: July 8, 2004
...Qi Zhu; Lunyu Ma; Suresh K. Sitaraman Microsystem packages continue to demand lower cost, higher reliability, better performance and smaller size. Compliant wafer-level interconnects show great potential for next-generation packaging. G-Helix, an electroplated compliant wafer-level chip...
