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Keywords: elastoplasticity
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045502.
Published Online: November 17, 2011
...M. Dube; T. Kundu 20 03 2006 13 08 2009 17 11 2011 17 11 2011 compressibility elastoplasticity hardening solders viscoplasticity We respond to the technical content of the discussion as follows: 1 Discussant appears to have erroneously assumed...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys lead-free solder alloy elastic-plastic-creep constitutive model time-independent strain time-dependent strain cyclic plasticity stress...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
Published Online: June 25, 2010
.... , 1999 , “ Elastoplastic Finite Element Analysis of Three-Dimensional Fatigue Crack Growth in Aluminum Shafts Subjected to Axial Loading ,” Int. J. Solids Struct. 0020-7683 , 36 , pp. 2231 – 2258 . 10.1016/S0020-7683(98)00059-6 ABAQUS ® Analysis User’s Manual, Version 6.7, Dassault Systèmes...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... elastoplasticity silver alloys solders stress-strain relations tensile testing tin alloys viscoplasticity lead-free solder alloy elasto-plastic-creep constitutive model time-independent deformation time-dependent deformation One significant problem in surface mounting technology...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 273–281.
Published Online: October 6, 2004
... packaging tin alloys wavelength division multiplexing optical communication equipment finite element analysis solders plastic deformation elastoplasticity Recently, there has been growing interest in developing fiber-optic networks to support the increasing bandwidth demands of lightwave...