... of steady state and transient operation of TECs on hot spot temperature reduction. Our numerical model incorporates the effect of Peltier cooling and Joule heating, due to the volumetric and contact resistances inside the TEC module, to analyze the temperature reduction at hot spots on the chip...

...Feng Gao; Jianmin Qu; Matthew Yao Reported in this paper is a quantum mechanics study on the electronic structure and contact resistance at the interfaces formed when an open-end single-walled carbon nanotube (CNT) is in end-contact with aluminum (Al) and palladium (Pd), respectively...

.... At the low temperature (below the melting point), the high pressure induced the residual inner stress to generate the cracks in the joints, and this also increased the contact resistance of the joints. The contact resistance increased with the pressure elevating at the same temperature...

...Christopher T. DeGroot; Derek Gateman; Anthony G. Straatman A numerical study on the effect of thermal contact resistance and its impact on the performance of finned aluminum foam heat sinks has been conducted. Calculations are based on the solution of the volume-averaged mass, momentum, and energy...

... ) of the conventional TEC as a function of r o c 05 11 2009 20 04 2010 08 09 2010 bismuth compounds contact resistance cooling Ge-Si alloys heat transfer microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models...

...Melida Chin; S. Jack Hu; James R. Barber Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important...

... aging showed significance within the first 100 h. I – V characteristics of the daisy chained ball grid array devices assembled with and without bumps revealed considerable difference in the breakdown current. The correlation between initial contact resistance of the daisy chain and the final breakdown...

.... Typically, thermal interfaces are filled with materials such as thermal adhesives and greases. Interface materials reduce the contact resistance between the mating heat generating and heat sinking units by filling voids and grooves created by the nonsmooth surface topography of the mating surfaces, thus...

... ACF joints by maintaining low contact resistance. By contrast, high contact resistance was found in assemblies treated with higher reflow. Under humidity aging (85°C/85%RH), bumpless chips proved to be unreliable due to corrosion mechanism. Moreover, ACF had shown degradation in chemical and physical...

...Rashed Adnan Islam; Y. C. Chan The contact resistances investigated by this study of ACF joints using Au ∕ Ni bumps and flexible substrates are found to be increased by the induced mechanical shock and also by the combined effect of heat/humidity and the mechanical shock. The samples humidified...

... received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 adhesives packaging fine-pitch technology electrical conductivity conducting polymers nickel gold contact resistance The simple connection method using anisotropic conductive adhesive (ACA) is noted...

... and effective medium theory. We then introduce a method of obtaining the contact resistance between the particles and the polymeric matrix by a combination of percolation modeling and experimental data. We also discuss the dependence of the mechanical response of these particle-laden polymers for different...

... contact resistance thermal conductivity integrated circuit packaging boundary-value problems thermal management (packaging) Many applications within the microelectronic industry encounter thermal contact resistance issues, such as the contact resistance across semi-conductor junctions...

..., the variation of contact resistance with probing force is outlined. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: B. Michel. 03 December 2001...

... of ultra fine pitch flip-chip interconnections using anisotropically conductive adhesives on a low-cost substrate. The reliability was characterized by single contact resistance measurement using the four-probe method during temperature cycling testing up to 3000 cycles. The Mean Time To Failure (MTTF...

... of high-density land-grid array connectors involves trade-off between conflicting performance requirements on the normal force, wipe, bulk resistance, contact resistance, stress, contact z -dimensional thickness, and z -compression. These stringent design requirements have significantly shrunk the space...