... by solving the steady-state three-dimensional energy equation (Eq. 4 ) with the finite volume method. 4 ∂ 2 T ∂ x 2 + ∂ 2 T ∂ y 2 + ∂ 2 T ∂ z 2 = 0 28 08 2006 19 12 2006 conducting materials thermal conductivity thermal...

... their reliability ( 2 ). flip-chip devices conducting materials encapsulation viscoelasticity adhesives reliability failure analysis finite element analysis 03 03 2004 07 08 2005 Liu , J. , Lai , Z. , Kristiansen , H. , and Khoo , K. 1998 , “ Overview...

... packaging flip-chip devices conducting materials adhesives finite element analysis electrical contacts fine-pitch technology Liquid crystal displays (LCD) have increasingly found industrial applications owing to their low power consumption, lower weight, better compatibility with LSI chips...

... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD July 13, 2000. Associate Editor: B. Coutois. 13 July 2000 titanium alloys thick films conducting materials electrical resistivity adhesion packaging Thick Film Metal...