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Keywords: coatings
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
Published Online: March 19, 2010
... interconnect applications in microelectronics packaging. The Cu particle surface modification by a coupling agent and its effects on the electrical conductivity and thermal stability of Cu-filled ACF joints were investigated for the potential alternatives of conventional Au-coated polymer and Au-coated Ni...
Journal Articles
Journal Articles