Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-3 of 3
Keywords: coatings
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
Published Online: March 19, 2010
... interconnect applications in microelectronics packaging. The Cu particle surface modification by a coupling agent and its effects on the electrical conductivity and thermal stability of Cu-filled ACF joints were investigated for the potential alternatives of conventional Au-coated polymer and Au-coated Ni...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
...Mark A. Trautman; Murli Tirumala; S. M. You An empirical study of pool nucleate boiling enhanced with a microporous coating was conducted within the context of microprocessor cooling. A thermal test vehicle (TTV) emulated the heat load from a general purpose microprocessor and delivered...
Journal Articles
Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
Published Online: October 20, 1999
...Jang-hi Im, Mem. ASME; Edward O. Shaffer, II; Theodore Stokich,, Jr.; Andrew Strandjord; Jack Hetzner; James Curphy; Cheryl Karas; Greg Meyers; David Hawn; Ashok Chakrabarti; Steve Froelicher This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene...