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Keywords: chip scale packages
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... parameters. As a result, the verified models can be used to determine the location of the critical solder joint and to obtain estimates of the solder lifetime performance. 27 12 2007 07 08 2008 12 02 2009 chip scale packaging finite element analysis high-speed techniques image...