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Journal Articles

The Effect of Intermetallic Growth on Bump Pull Test Responses of SAC105 Solder Bumps

Jose Omar S. Amistoso, Alberto V. Amorsolo, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041004.
https://doi.org/10.1115/1.4000206
Published Online: October 21, 2009
.... Observed solder bump failure modes Figure 11 presents typical bump pull failure mode images observed in the study. Mode 1 failures correspond to bulk solder bump failures indicative of good solder bump integrity. Mode 2 failures represent brittle fracture that is dominant at the solder bump-to-UBM...
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Topics: Intermetallic compounds, Solders, Temperature, Tin, Semiconductor wafers, Failure mechanisms
Journal Articles

Design Guideline for Ball Impact Test Apparatus

Chang-Lin Yeh, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
https://doi.org/10.1115/1.2429716
Published Online: April 18, 2006
... testing brittle fracture solders electronics packaging reliability ball impact test (BIT) solder joint structural dynamics transient structural responses design guideline The prevalence of mobile electronic devices along with the adoption of stiffer and more brittle lead-free solder...
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Topics: Brittleness, Design, Fracture (Process), Impact testing, Reliability, Solder joints, Transients (Dynamics), Damping, Structural dynamics
Journal Articles

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Bingzhi Su, Y. C. Lee, Martin L. Dunn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 369–377.
https://doi.org/10.1115/1.1602702
Published Online: September 17, 2003
... . Manuscript received May 2002. Associate Editor: Z. Suo. 01 May 2002 17 09 2003 gallium arsenide III-V semiconductors brittle fracture crack-edge stress field analysis soldering indium lead packaging finite element analysis Gallium arsenide (GaAs) semiconductors...
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Topics: Corners (Structural elements), Fracture (Materials), Fracture (Process), Gallium arsenide, Geometry, Solders, Stress, Brittleness, Temperature, Finite element analysis