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Keywords: brain information processing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 346–352.
Published Online: December 6, 2005
... performance will be hindered by the need for large power supplies and high-capacity heat rejection systems. 27 04 2005 06 12 2005 microprocessor chips power consumption electronics packaging exergy exergy energy efficiency information processing brain information processing...
