...Liu Chu; Jiajia Shi; Eduardo Souza de Cursi Ball grid arrays (BGAs) offer significant advantages in the automotive industry, such as their small size and high integration density, making them a promising electronic packaging approach. However, the operating environment of automobiles is more...

... factor somehow lead to issue associated with possibility of incomplete filling or void formation. Dot dispense pattern shows less void formation since it produces high-pressure underfill flow within the ball grid array (BGA). This paper provides reliable insight into the industry to choose the best...

... capability, this method is applied to a plastic ball grid array package design. Multidisciplinary criteria including thermal, structural, electromagnetic leakage, and cost are optimized simultaneously using key design parameters as variables. A simplified routability criterion is also considered...

...Mudasir Ahmad; Ken Hubbard; Mason Hu Ball grid array solder joint reliability is known to be dependent on the shape of solder joints after reflow. To ensure good solder joint formation and prevent solder bridging, it is critical to understand the amount of paste volume needed during assembly...