Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-3 of 3
Keywords: X-ray diffraction
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
... dispersive X-ray analysis determines the composition as 69 wt. % iron (Fe), 19 wt. % chromium (Cr), 10 wt. % nickel (Ni), around 2 wt. % manganese (Mn), and less than 0.08 wt. % carbon (C), which agrees well with the data provided by the manufacturer. Diffraction peaks produced by X-ray diffraction (XRD...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034502.
Published Online: July 14, 2009
... to bond SiC dice to Si 3 N 4 substrates. The dice were bonded using transient liquid phase bonding. Samples were characterized using X-ray diffraction for phase identification and Auger electron spectroscopy for depth profiling of the elemental composition of the metallization stack in the as-deposited...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
Published Online: July 26, 2002
...G. Y. Li; Y. C. Chan Intermetallics formation between metallization conductor Pd-Ag and solder 62Sn-36Pb-2Ag have been investigated by transmission electron microscopy (TEM) and X-Ray diffraction. Energy-dispersive X-Ray (EDX) analysis and Selected Area Electron Diffraction (SAED) analysis reveals...