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Keywords: X-ray chemical analysis
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
Published Online: February 18, 2009
... and SnAg solder is reliable. electroplating metallurgy scanning electron microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis SnAg solder bump reliability Flip-chip technology has been applied in interconnecting a large number...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
Published Online: July 26, 2002
... transmission electron microscopy X-ray chemical analysis X-ray diffraction electron diffraction palladium alloys silver alloys lead alloys Thick film hybrid circuit technology is widely used in hybrid microelectronics. This has been an extremely important technology because of the applications...
