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Keywords: Wire Interconnect Technology
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
Published Online: July 26, 2002
... (WLP) technologies. The urgent demand high I/O density and good reliability characteristics have led to the evolution of ultra high-density non-solder interconnection, such as wire interconnect technology (WIT). New technology, which uses copper posts to replace the solder bumps as interconnections...