... scale package (WLCSP) is one of the emerging package technologies that have the key advantages of reduced cost and smaller footprint. The portable consumer electronics are frequently dropped; hence, the emphasis of reliability is shifting toward the study of effects of mechanical shock loading...

..., the package with smaller solder joints and a smaller joint pitch suffers a greater drop reliability concern. 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP...