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Keywords: Thermoelectric cooler
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
... of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,” ASME J. Electron. Packag. 132 (2), p. 024501). The author would like to thank Dr. S. Lineykin for the correspondence discussion about this method via e-mails. 18 05 2010 25 05 2011 14 09...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 339–347.
Published Online: November 5, 2006
...Boris Abramzon The present study proposes a unified numerical approach to the problem of optimum design of the thermoelectric devices for cooling electronic components. The standard mathematical model of a single-stage thermoelectric cooler (TEC) with constant material properties is employed...
